Micro-Electronics and Telecommunication Engineering

Micro-Electronics and Telecommunication Engineering: Proceedings of 3rd ICMETE 2019

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Hardback Published on: 03/04/2020
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Publisher information

  • Publisher: Springer Verlag, Singapore
  • ISBN: 9789811523281
  • Number of pages: 735
  • Dimensions: 235 x 155 mm
  • Languages: English

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