Advances in Electronic Circuit Packaging

Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Paperback Published on: 01/01/1962
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Publisher information

  • Publisher: Springer-Verlag New York Inc.
  • ISBN: 9781489972972
  • Number of pages: 328
  • Dimensions: 254 x 178 mm
  • Languages: English

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