3D Microelectronic Packaging

3D Microelectronic Packaging: From Architectures to Applications

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Hardback Published on: 24/11/2020
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Publisher information

  • Publisher: Springer Verlag, Singapore
  • ISBN: 9789811570896
  • Number of pages: 622
  • Dimensions: 235 x 155 mm
  • Languages: English

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