Quilt Packaging: A Novel High Speed Chip-To-Chip Communication Paradigm for System-In-Package

Quilt Packaging: A Novel High Speed Chip-To-Chip Communication Paradigm for System-In-Package

Paperback Published on: 01/09/2011
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Synopsis

  • Publisher: Proquest, Umi Dissertation Publishing
  • ISBN: 9781243460134
  • Number of pages: 216
  • Weight: 435g
  • Dimensions: 254 x 203 x 14 mm

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